| Wipro architects and tapes out
a 0.13 micron, low-power design or MP3 SoC in 6
months |
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| The customer |
| Global leader in
design and manufacture of high performance mixed-signal
integrated circuits (ICs). |
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| The challenge |
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Client wanted
a low-power design for a SoC for MP3 player |
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Multi-device interface
and USB 2.0 compatibility for greater market
reach |
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High performance at low
cost |
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| The solution |
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Involved from
architectural validation phase to the final
system validation |
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Qualified and integrated
various third-party IP |
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0.13 micron fabrication
with die size of 6.4 mm X 4 mm |
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Development of micro-architecture
and physical design |
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Co-development of power
management unit |
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Post-silicon validation
at customer location with Silicon target board
and HP tester |
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Embedded software development |
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| Business benefits |
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First silicon
success |
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Concept to tape-out was
completed in 6 months |
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An additional LCD module
to be incorporated without change in die size |
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