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Case Study

Automotive SoC integration and physical design

The customer

Our customer is a leading, US based semiconductor manufacturer and a market leader for automotive System-on-Chips.

The challenge

The customer required the tape-out of 10-12 ARM based SoC designs annually, involving extensive integration and physical design activities, and establishing our engineering prowess in that aspect of IC design.

The solution

A 45 member SoC team at Wipro mobilized itself on the requisite tools flow and training within a time span of 10 months, and today efficiently executes RTL to GDSII activities, having streamlined its design flow to conform to the customer’s SoC design-platform strategy. Besides the complete integration and backend work, the team also provides module customization, upgrading designs to higher frequency, and the conversion of assembly test cases to tool design language to aid in silicon verification.

A snapshot of the work executed includes:

	Combination of single-CPU and dual-CPU designs
	Design gate count varying between 400k to 1.2 mn
	Frequency of operation ranging between 30 Mhz to 75 Mhz
	Size varying from 4 sq. mm to 30 sq. mm

The benefit

The benefit was flawless execution of a large project entirely off-shore, combining quick and effective streamlining of tools flow and engineering operations to ensure a steady output of on-schedule, world-class quality SoCs, that have all been first time silicon successes.


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