Wipro leverages on its in depth domain expertise
to provide challenging and comprehensive system
solutions by means of ASIC, SoC, core technology
IP blocks, Board and FPGA/PLD designs, meeting
critical time-to market demands of the customers
with design reliability, scalability and upgradeability.
The packages that we offer semiconductor companies
are:
Time to
Silicon Package
Independent
silicon verification
IP qualification,
Delivery, Customization and Integration
Interface
to Foundry, Test and Packaging houses
Chip validation
with evaluation boards/diagnostics
Methodology/Design
Flow consultancy
Time to
Volume Package
Reference
System Design services (HW + SW)
Prototype
and Production Volumes for Reference Platforms
Demo Boards
Turnkey Board
design
Applications
and other Software components
Model Creation
/ Conversion Services
Turnkey Design
of complementary chips, to promote adoption
of “Silicon"
Product
Sustenance Package
Retargeting
services to different technology/foundry
Re-engineering
to add features or performance Improvements
Embedded
Software Design Services to create new applications
around the silicon
Cell
Library Development Support for Technology/Foundry
Transitions
Product
Support Package
4 Tier Support Infrastructure for Semiconductor
Companies:
Level 1 : Address requests for readily
available documents, datasheets, application
notes , Reference Design Kits, Software
as required.
Level
2 : Address support issues which can
be handled by standard answers available
in FAQs, Application Documents.
Level
3: Address support issues related to
reported bugs, and identify workarounds
for reported problems.
Level
4: Address issues which needs to be
fixed in the silicon, if any, by making
any design changes/enhancements without
taking the bandwidth of the Original
Design team.
Creation of supporting collaterals such as
Application Notes, Design Guidelines, Sample
boot up code, Diagnostics, Reference Designs,
schematics etc.
