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Case Study
 
Automotive SoC Integration and Physical Design
 
The client
A leading, US based semiconductor manufacturer and a market leader for automotive System-on-Chips
 
The challenge
The client required the tape-out of 10-12 ARM based SoC designs annually involving extensive integration and physical design activities thereby establishing our engineering prowess in that aspect of IC design.
 
The solution

The customer works on cutting edge automotive SoC solutions that are primarily based on the ARM processors. Wipro's SoC Center complements the customer's SoC designs by providing extensive SoC integration activity along withcustomization and development of design modules out of the India Development Center.

Wipro set up a 80 member System-on-Chip team for the customer for complex hardware design projects. The SoC team at Wipro mobilized itself on the requisite tools flow and training within a short time span of 3 months. Today the team efficiently executes specification to product engineering, having streamlined its design flow to conform

to the customer's SoC design-platform strategy. Focused efforts in the design cycle in both functional and managerial responsibilities have enabled Wipro to stand tall and deliver quality products, meeting the customer's business goals.

A snapshot of the work executed includes
Combination of single-CPU and dual-CPU designs
Design gate count varying between 400k to 1.2 mn
Frequency of operation ranging between 30 Mhz to 75 Mhz
Size varying from 4 sq. mm to 30 sq. mm.
 
The benefit
End to end responsibility from specifications to tape-out
Significant reduction in product realization time
 
Read the complete case study
 
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